Enclosures & Thermal Management

Here are a few examples of the tools we use to help you get the job done

(NEMA/IP rated, size and material matched to environment and heat load)

✅ Protects against environmental hazards (dust, moisture, heat, washdown)
✅ Provides the foundation for passive or active thermal management
✅ Right-sizing prevents thermal buildup by allowing proper airflow or cooling

Typical problems solved:

• Overheating due to undersized panels

• Component failure from exposure (moisture, dust, chemicals)

• Insufficient space for airflow or future expansion

(Simple airflow management without active cooling)

✅ Promotes natural convection inside the enclosure
✅ Keeps out contaminants while allowing heat to escape
✅ Low-cost, no-maintenance solution for moderate heat loads

Typical problems solved:

• Hot spots around high-wattage components

• Humidity buildup

• Over-reliance on active cooling when not needed

(Fan trays, enclosure air conditioners, Peltier coolers, panel heaters)

✅ Controls internal temperature under high heat loads
✅ Prevents condensation in cold or humid environments
✅ Maintains stable conditions for sensitive electronics

Typical problems solved:

• High ambient temperature + heat-generating loads

• PLCs or VFDs shut down due to thermal thresholds

• Electronics are degrading from condensation during cold starts

(Gap fillers, insulating gaskets, thermal pads)

✅ Improves heat dissipation from critical components
✅ Reduces micro hot spots inside dense assemblies
✅ Enhances panel sealing while allowing thermal transfer

Typical problems solved:

• Component hot spots that ventilation alone can’t fix

• Premature sensor drift, relay chatter, or module resets

• Maintaining NEMA/IP integrity while managing heat

How We Help:

• Thermal guidance based on actual load and enclosure layout
• Help avoid nuisance trips and unexplained shutdowns
• Application-driven mounting and airflow strategies
• Fast response, clear answers, and follow-through after the install

We also consult on design strategies:

• Using thermal interface materials to eliminate micro air gaps
• Designing for convection paths instead of relying only on active cooling
• Separating high-heat components from signal or sensor wiring